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Microwave Theory and Techniques Society Distinguished Microwave Lecturer Program Last update: 01/30/2010 - V.Rosati The Microwave Theory and Techniques Society, via the Technical Coordinating Committee, each year carefully selects a group of Distinguished Microwave Lecturers who are recognized experts in their fields. New DMLs Selected In September, 2009 the Administrative Committee (AdCom) selected five new Distinguished Microwave Lecturers:
Andrea Ferrero (IT), Stepan Lucyszyn (UK), Anh-Vu Pham (US), Manos Tentzeris (US),and Ming Yu (CA).
The lecturers are available to present talks to local MTT-S chapters world-wide. MTT-S provides a budget to help defray travel expenses. MTT-S chapters usually cover only local expenses such as meals. Local chapters are invited and strongly encouraged to take full advantage of this unique resource. Speakers give six to seven talks per year so it is prudent to schedule well in advance. Contact the speaker directly to request a talk. If you are unable to reach the speaker directly, please contact DML speaker coordinator Larry Whicker (TCC Administrator) for assistance.
Distinguished Microwave Lecturers Emeritus 2010 The Society thanks and congratulates Professor Ali Hajimiri, Dr. Linus Maurer, Mr. Vijay Nair, Dr. Richard Snyder, and Dr. Huei Wang for completing their terms as Distinguished Microwave Lecturers. As DML Emeritus 2010 they can continue to deliver invited lectures under the MTT Speakers Bureau program. Their lecture topics and abstracts are available here.
Previous Distinguished Microwave Lecturers Topics and abstracts of previous DML talks can be can be found here.
Current Topical Areas (Alphabetical order; *=New) Applications
of Ferroelectrics in Microwave Devices, Circuits and Systems (Spartak
Gevorgian)
Commercial Applications of RF MEMS* (Stepan Lucyszyn)
Engineering and Measuring
RF Waveforms - the Unifying Link Between System Performance, Circuit Design
and Transistor Technology (Paul Tasker) Enhancing the
Efficiency of Computer-Aided Analysis and Design through Physics-Based Model
Complexity Reduction (Andreas Cangellaris) Inkjet-Printed Paper/Polymer-Based "Green" RFID and Wireless Sensor Nodes: The Final Step to Bridge Cognitive Intelligence, Nanotechnology and RF? (Manos Tentzeris) Liquid Crystal Polymer for Microwave and Millimeter-Wave Multi-layer Packages and Modules* (Anh-Vu Pham) Multiport Vector Network Analyzer* (Andrea Ferrero) Power Handling and Temperature Compensation Design for Passive Microwave Devices* (Ming Yu) Radio Frequency Integrated Circuits for Adaptive Beamforming (Frank Ellinger) SDR Based Power Amplifiers /Transmitters for Advanced Wireless and Satellite Communications (Fadhel Ghannouchi) Substrate Integrated Circuits (SICs) for Microwave and Millimeter-Wave Systems and Applications (Ke Wu)
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Current Distinguished Microwave Lecturers
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Andrea Ferrero Start Year 2010 Professor
Dip. Elettronica Politecnico di Torino
Duca degli Abruzzi 24 10129 Torino, Italy
Tel:+390115644082 FAX:+390115644099
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MULTIPORT VECTOR NETWORK ANALYZER From the beginning to modern signal integrity applications
With the recent digital systems and circuits outstanding increase in speed and complexity, multiport characterization at microwaves and millimeter waves is experiencing an impressive growth in demand and importance. Today the application of multiport techniques is shifting from typical microwave applications to signal integrity in computer technologies.
The importance of the VNA design as well as the calibration techniques which guarantees the accuracy is a must when low level crosstalk needs to be measured or when differential S-parameters are used.
The talk will present the most modern solutions for multiport measurements at microwave frequencies as well as their advance calibration techniques.
In particular the following topics will be given with the focus on multiport application:
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Start Year 2010
FIEE, FInstP, FEMA,
SMIEEE Guest Professor Tsinghua University (Beijing, China) Adjunct Professor UESTC (Chengdu, China) IEEE Distinguished Lecturer (2010-2012)
Mobile (Inter.): + 44 (0)7717 000369
Mobile (Japan):
+ 81 (0)80 5034 5775
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Commercial Applications for RF MEMS
Radio frequency micro-electro-mechanical systems (RF MEMS) have been heralded as a technology fit for the 21st century, offering unsurpassed RF performance over more conventional solid-state electronic devices. In recent years, this technology has seen a rapid rate of expansion because of its potential for advancing new products within a broad range of applications; from ubiquitous smart sensor networks to mobile handsets. Indeed, within the US, Asia and Europe, R&D is almost at fever pitch. The high levels of investment come second only to the expectations for commercial exploitation. The first RF MEMS device was reported 30 years ago by IBM. After experiencing the peak of inflated expectation in 2003 and subsequent trough of disillusionment in 2005, RF MEMS switches have emerged into the slope of enlightenment. They are now commercially available on the open market, offering new solutions for realizing high performance reconfigurable microwave circuits and systems. A major new book, entitled Advanced RF MEMS (edited by the speaker), is scheduled for publication at the beginning of 2010. This lecture will explain the many facets of this technology and demonstrate how RF MEMS can move itself out of the laboratory and into real commercial applications.
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Start Year 2010 Professor University of California, Davis Department of Electrical and Computer Engineering 3141 Kemper Hall One Shields Ave Davis, CA 95616
Phone: (530) 752-7472 Cell: (916) 719-6886 Fax : (530) 752-8428
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Liquid Crystal Polymer for Microwave and Millimeter-Wave Multi-layer Packages and Modules Hermetic packages are used to protect microwave and millimeter-wave monolithic integrated circuits against harsh environmental conditions, including changes in atmospheric pressure, humidity, moisture, and other natural hazards that would otherwise disrupt electrical connections or damage delicate electronics. Microelectromechanical systems (MEMS) require hermetic packaging to prevent against contaminating particles and moisture. Hermetic packages have a fine helium leak rate of ~1x10-11 atm-cc/sec and are known to provide the reliability in harsh environments. Current hermetic packages are based on metal and ceramic materials. Ceramic and metal packages are heavier, bulkier, and more expensive than organic counterparts. At the wafer-level packaging, high temperature wafer bonding is used to form hermetic cavities that result in tall structures. While organic packaging technology cannot provide true hermeticity, can it have a low enough leak rate to achieve competitive reliability? This is referred as “reliability without hermeticity” or near hermetic packaging. In this lecture, we will review the concept of hermeticity and near-hermeticity in electronic packages. Liquid Crystal Polymer (LCP), which has permeation close to glass, will be introduced as the next generation organic material for near-hermetic packaging. We will discuss results of LCP material characterization. We will then present the development of sealing techniques of LCP onto LCP and LCP onto semiconductor materials to form near hermetic cavities for housing MEMS and MMICs. Using the newly developed sealing techniques, we will demonstrate LCP wafer-level packages, surface mount packages and multi-chip modules to 40 GHz. Examples of wafer-level packages include the lamination of LCP onto Si to cap or package RF MEMS switches and a phase shifter with LCP-packaged MEMS. We will also present the development of low-loss surface mount LCP packages to 40 GHz. These surface mount packages are designed with novel feedthroughs that achieve a measured insertion loss of ~0.2 dB to 0.4dB up to 40 GHz and provide embedded filters. We will discuss bond wire compensation schemes, package to printed circuit board transition design techniques, electrical repeatability, and thermal performance of millimeter-wave surface mount packages. Reliability evaluation will be presented to demonstrate the robustness and reliability of LCP packages. Examples of the environmental tests include 1000 hours of 85oC and 85% humidity, temperature cycles, thermal shock, etc. Finally, we demonstrate the development of compact wide bandwidth passive components, multi-chip modules, and phased array antennas in multi-layer LCP boards at Ka-band.
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Start Year 2010 GEDC Associate Director for RFID/Sensors Research
Homepage: http://www.ece.gatech.edu/~etentze
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Inkjet-Printed Paper/Polymer-Based "Green" RFID and Wireless Sensor Nodes: The Final Step to Bridge Cognitive Intelligence, Nanotechnology and RF?
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Start Year 2010 Fellow, IEEE Chief Scientist and Director of R&D COM DEV 155 Sheldon Drive Cambridge Ontario N1R 7H6 Canada
Adjunct Professor Department of Electrical and Computer Engineering University of Waterloo
Tel: 519 622 2300 x 2503 MING.YU@IEEE.ORG
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Power Handling and Temperature Compensation Design for Passive Microwave Devices
Modern communication and radar transmitter systems require high performance RF/Microwave devices and components, to improve communication and detection range. The increase in range is accomplished by increased transmitted power and higher receiver sensitivity. The increased transmitted power requires the engineer to estimate the transmitter’s power handling capability as part of the design process. In addition, the engineer has to meet several competing requirements at a specified pressure level, such as containment of transmitted bandwidth (wide or narrow, i.e., reduce adjacent channel spill over), minimize group delay variations, and reduce performance drifts with environmental condition changes (e.g., temperature, pressure, and humidity). When designing devices for these high-power operations, one often has to take into account the following effects: multipactor and ionization breakdown, passive intermodulation interferences and thermal-related issues such as temperature compensation. This talk will elaborate the physics background, technical challenges and design methodologies. It will also cover the clever use of both circuit and electromagnetic modeling techniques. Numerous examples will be presented from those widely used in the industry. The method presented is general and is applicable to all device types.
The following topics are also offered by the author: "Overview of High Performance Microwave Filter Technologies", "Miniaturization of Microwave Filters using Predistortion and Dissipative techniques" and "Electromagnetic Simulator for the Design of Large Microwave Circuits ".
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Start Year 2009
Dresden University of Technology Head of Chair for Circuit Design and Network Theory Barkhausenbau 119, Helmholtzstrasse 18, 01069 Dresden, Germany
Tel: +49/351/46338735 Frank.Ellinger@tu-dresden.de homepage: http://ccn.et.tu-dresden.de |
Radio Frequency Integrated Circuits for Adaptive Beamforming
By means of adaptive antenna combining the tradeoff between coverage range, reliability, data speed and power consumption can be improved in wireless systems. By smart weighting of the phases and amplitudes of multiple antenna signals, the antenna gain can be increased and intersymbol interferences can be reduced. Most systems perform the vector weighting of the antenna signals in the baseband. Since multiple circuit paths are required from RF to baseband, the resulting power consumption and costs are very high.
These drawbacks can be mitigated by performing the adaptive combining in the radio front-end. In this case, only one path from IF to baseband is required. To reduce the control complexity, the phase shifters should vary the phase without manipulating the gain, and the gain control components should adjust the gain without changing the phase. However, if we e.g. vary the transconductance or the load resistance in amplifiers for gain control, the RC time constants of the transistors change leading to significant undesired phase variations. Further challenges such as integration into silicon, sufficient bandwidth, good large signal properties, low power consumption and compact size have to be considered.
In this lecture, these challenges are addressed and solutions are proposed. Different architectures are compared performing the adaptive combining in the RF, LO and IF sections. Several concepts implemented in both CMOS and III/V technologies are presented. The compact and fully integrated circuits are optimized for high speed applications operating in accordance to the 802.11a/n standard at C-band. Detailed theoretical studies are made enhancing circuit understanding and enabling efficient optimizations.
Phase compensation techniques in variable gain amplifiers and topologies mitigating phase variations by using RC and biasing dummy paths are demonstrated. These topologies are compared with passive attenuator based approaches.
A variety of different active and passive phase shifter RFICs based on vector modulators, varactor tuned transmission lines, reflection-type phase shifters with multiple parallel reflection loads, etc. are discussed and compared.
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Start Year 2009 Fellow IEEE and Fellow IET CORE Professor and Senior Canada Research Chair, Director, iRadio Laboratory (www.ucalgary.ca) Department of Electrical and Computer Engineering Schulich School of Engineering, University of Calgary, Canada
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SDR Based Power amplifiers /Transmitters for Advanced Wireless and Satellite Communications
The next wave in the information revolution will consist of bringing intelligence to the information and communication technology (ICT) sector, allowing seamless and intelligent networking and communication between different users using different services and operators. This will lead to the convergence of communication technologies, aiming at the development and deployment of cooperative and ubiquitous networks that involve existing and future wireless and satellite communications systems.
A critical element in enabling the convergence of different communication systems is the development of software defined radio (SDR) systems that can be used across different frequency bands and for multi-standard applications. This SDR has to be developed to support different frequency carriers and modulations schemes concurrently, in addition to being power- and spectrum-efficient, in order to be able handle high data rates, while being less energy-hungry and more environmentally friendly.
The design of power amplifiers as critical components in any SRD based communication terminal has to be considered closely together with the system architecture, in order to ensure optimal system level performances in terms of linearity and power efficiency. This implies the use of adequate transmitter architectures that convert the analog baseband information to architecture dependent amplifier driving signals, such as sigma-delta, EE&R, Polar and LINC architectures. This talk lays out the principles behind SDR systems and examines the design of software-enabled linear and highly efficient RF/DSP co-designed power amplifiers/transmitters for multi-standard and multi-band applications. Recent advances and practical realizations will also be presented and discussed.
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Start Year 2009 Canada Research Chair in RF and Millimeter-Wave Engineering Poly-Grames Research Center Department of Electrical Engineering Center for Radiofrequency Electronics Research (CREER) of Quebec Ecole Polytechnique (University of Montreal)
M-6021, Pavillon Lassonde Ecole Polytechnique 2500 Chemin de Polytechnique Montreal, Quebec, Canada H3T 1J4 Tel : 1-514-340-4711 ext. 5991
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Substrate Integrated Circuits (SICs) for Microwave and Millimeter-Wave Systems and Applications Widespread applications and commercial success of future GHz and THz electronic and photonic devices and systems including RF, microwaves and millimeter-waves are closely related to their manufacturing cost and circuit integration. Our proposed integration technologies of planar and non-planar structures as well as related new progress indicate that the emerging substrate integrated circuits (SICs) are able to provide unprecedented advantages for developing low-cost GHz/THz components, systems and wireless photonic applications. This talk reviews the state-of-the-art and underlying features of the proposed integration platforms for designing the next generation RF and millimeter-wave ICs and systems. Challenging issues and future directions are discussed for research and developments. Potential problems and possible solutions are also presented. It is believed that the newly proposed concept of SICs will offer a potentially cost-effective and performance-promising solution for mass commercial applications. With the development of innovative fabrication processes and material synthesis techniques, unique hybrid and monolithic high-density 3-D integration of planar and non-planar structures (or system-on-substrate approach) become realizable. It can also be demonstrated that this scheme of SICs effectively bridges the gap between electronics and photonics. In this presentation, our current research activities and future RF and millimeter-wave research directions will also be discussed |
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Start Year 2008
M. E. Van Valkenburg Professor Department of Electrical and Computer Engineering 357 Everitt Lab, Urbana,
IL 61801 Phone:
217-333-6037; Fax: 217-333-5962 |
Enhancing the Efficiency of Computer-Aided Analysis and Design through Physics-Based Model Complexity Reduction Key topics that will be addressed are: a) State-space representations of discrete electromagnetic models;
b) Development of state-space models from measured, frequency/time-domain data;
c) Tackling the multi-scale time complexity in the simulation of non-linear microwave components and systems;
d) Complexity challenges in multi-domain physics modelling for microwave component and system design.
Despite their breadth and generality, there is a significant interconnectivity of these topics that can be used to streamline the presentation toward the specific interests of the audience. Andreas would like to keep it broad enough with the understanding that he will be coordinating with the inviting institution for the streamlining of the presentation according to their interests.
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Spartak Gevorgian Start Year 2008 Spartak Gevorgian Department of Microtechnology and Nanoscience, Chalmers University
of Technology and time) Sweden, 412 96 Gothenburg Sweden Tel: +46317721727 spartak.gevorgian@mc2.chalmers.se; spartak.gevorgian@ericsson.com
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Applications of Ferroelectrics in Microwave Devices, Circuits and Systems Synopsis: Application of the ferroelectrics in microwave devices, circuits and systems is gaining momentum. After years of extensive material optimization and development of the laboratory device demonstrators, several companies started commercial developments and marketing of the complex microwave circuits and systems based on the ferroelectric films and varactors. The presentation reviews the current status of the applications of the ferroelectrics in microwave devices, circuit and systems. At present ferroelectric films are used in passive microwave devices and circuits (decoupling capacitors, low impedance and fixed delay time transmission lines, field dielectrics in CMOS devices etc.). A short introduction demonstrates the advantages of the ferroelectrics (varactors) in comparison with the competing technologies (low loss, high speed, small size, low power consumption/low leakage currents, simple fabrication process, cost effective etc.). The presentation covers the applications of ferroelectrics in phase, frequency and amplitude agile systems including: • Ferroelectric-based resonators, tuneable filters and matching networks • Ferroelectric-based mixers and harmonic generators • Phase shifters and delay lines based on ferroelectrics • Voltage controlled oscillators and amplifiers using ferroelectric varactors • Steerable beam antennas and phase arrays • Tuneable metamaterials, frequency selective and impedance surfaces • Thin Film Bulk Acoustic Wave Resonators (TFBAR) and filters
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Paul Tasker Start Year 2008 Prof. Paul Tasker Queen's Buildings The Parade Tel: +44 (0)2920 8 74423 (Direct) +44 (0)2920 8 74930 (Research Office) Tasker@cf.ac.uk
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Engineering and Measuring RF Waveforms — the Unifying Link Between System Performance, Circuit Design and Transistor Technology This talk discusses how appropriately engineered RF waveforms can help meet telecommunication system goals such as power, efficiency, and linearity. It is well known that the performance of transistors in power amplifiers is linked to their mode of operation (Class A, A/B, C, etc.). A number of measurement systems now allow for the direct measurement of RF waveforms, either at RF or in the envelope domain. Coupling such systems with impedance control hardware enables experimental control (engineering) of these terminal RF waveforms. Because these measurement systems operate in the time domain they allow for a more natural integration of measurement and CAD simulation based design approaches. This talk touches on several topics of interest to microwave engineers including modelling and measurement of power amplifier transistors and circuits; design and predistortion correction of nonlinear telecommunication systems; and circuit design methods that incorporate new transistor technology. Examples will demonstrate measurement feedback to support and link both the design of high power amplifier transistor technology (GaAs HBT/HFET, GaN HFET, Si LDMOS) and the circuit environment (harmonic load-pull, linearisation via base-band injection).
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