TFB: ADVANCES IN SIGNAL INTEGRITY MODELING AND ANALYSIS

Date & Time: Friday, June 17; 8:00 AM to 12:00 PM

Location: Long Beach Convention Center, Room 203C

Topics & Speakers: 

• High-Speed Signal Integrity Issues, M. Abdulla, Intel Corporation  

• Signal Integrity Methodologies; Time Domain vs. Frequency Domain, A. Badawi, Cairo University

• Power Delivery Analysis,  M. Swaminathan, Georgia Institute of Technology  

• EMI/EMC and Advanced Topics including Electromagnetic Band Gap Structures, O.M. Ramahi, University of Maryland at College Park

Organizers:

M. Abdulla, Intel Corporation

O. M. Ramahi, University of Maryland at College Park   

Sponsors:

MTT-1: Computer-Aided Design

MTT-15: Microwave Field Theory  

In the last decade, the accumulated knowledge on signal integrity analysis and design has matured considerably. This is accompanied by the emergence of specialized simulations, modeling, and analysis tools. Typically, signal integrity analysis is applied to the system, package, and on-die circuit design cycles. Furthermore, in complex system design, the signal integrity requirements strongly drive the physical design of the system, such as on-die layout, package and board designs. In addition, the on-chip system integration is among the current industry trends and consequently, it makes signal integrity analysis a critical part in the design cycle. Therefore, accurate and complex models that include second order effects become an essential part in studying and analyzing the whole system performance. Consequently, measurement, characterization, and validations of these models become very vital in order to maximize the models accuracy and render them more beneficial to the analysis. With chip frequency approaching 5GHz and beyond and with the integration of RF fronts ends in mobile computing platforms, microwave principles have to be applied for managing electromagnetic interference. This is becoming a major problem due to the complexity of the system containing thousands of interconnects with embedded RF functions in the package.

This half-day workshop covers recent advances in signal integrity modeling and design. The topics covered include on-die substrate coupling, a subject that has recently received considerable attention, especially with the emergence of the need for GHz range mixed signal designs integration. The workshop will also discuss modeling of on-die inductors and on-board EBG structures, two critical advances that are expected to have a strong impact on board and chip design. Moreover, the workshop will discuss practical 3D modeling for interconnects in full wave analysis packages, including accurate port definitions and placement. Different methodologies for targeting a comprehensive understanding for the system under test in both the frequency and time domains will be addressed. This workshop will present these and other critical advances, but more importantly, the workshop will address the relevance of these advances to practical real-world engineering design.