WMF: PACKAGING AND INTERCONNECTS FOR MICROWAVE PHOTONICS APPLICATIONS

Date & Time: Monday, June 13; 8:00 AM to 12:00 PM

Location: Long Beach Convention Center, Room 204

Topics & Speakers: 

• Chip to chip Gbit/sec optoelectronic interconnects for microwave monolithic integrated circuits, R. Simons, NASA Glenn Research Center

• Packaging and interconnect considerations for 40Gbits/sec optoelectronic components, K. Goverdhanam, Agere Systems

• Micromachined integrated packages for optoelectronic applications, R. Drayton, University of Minnesota

• Stacked-thin-film surface-mount packaging with high density and high resolution for compact, high-performance 40 Gbps applications, L. Studebaker (Centellax), W. Sitch (Centellax), and J. Wolf (American Technical Ceramics)

• The Space Radiation Environment and It's Effect on Semiconductors and Fiber Optic Systems, K. A. LaBel, NASA/GSFC  

Organizers:

K. Goverdhanam, Agere Systems

R. N. Simons, NASA Glenn Research Center  

Sponsor:

MTT-3: Microwave Photonics

Design of efficient packages and interconnects plays a vital role in the performance of high speed optoelectronic components. In this workshop, various topics that address these challenges for a range of opto-electronic components from 2.5GBits/sec to 40Gbits/sec will be presented. Emphasis will be placed on electromagnetic field theoretical aspects behind the package and interconnect design as well as on developing manufacturable packaging solutions. Integrated optoelectronic packaging techniques using micromachining will be presented. Novel optoelectronic interconnect schemes for intra/inter chip signal transfer will be discussed. In addition, packaging considerations from a radiation tolerance perspective, space radiation effects on semiconductor and optical systems and ways to mitigate bit error rate degradation due to radiation will be presented.