WMJ: LOW COST PACKAGING FOR MICROWAVE AND MILLIMETER-WAVE PRODUCTS  

Date & Time: Monday, June 13; 1:00 PM to 5:00 PM

Location: Hyatt Regency B

Topics & Speakers:  

• Ceramic and Ceramic Enhanced Packaging for Microwave Applications, B. Jennings, AdTech Ceramics

• Achieving Low Thick Film Microwave Circuits, C. Kucenas, Microplex, Inc.

• Cost Drivers in Thin Film Circuits, B. St. Pierre, Ultra Source

• Laminate Technology Packaging, J. Dobrick, Rogers Corporation

• Application Specific Integrated Packages (ASIP), C. Conlin, Jacket Micro Devices

• HDI, LCP and emerging packaging technologies, J. Laskar, Georgia Institute of Technology

• Low cost MEM packaging, D. Hyman, Xcom Wireless

• Low Cost High Power Packaging, R. Sturdivant, Microwave Packaging Technology, Inc.

Organizers:

R. Sturdivant, Microwave Packaging Technology, Inc.

W. Heinrich, Ferdinand-Braun Institute

A. Lindner, Remec, Inc.  

Sponsor: 

MTT-12: Microwave and Millimeter-wave Packaging  

Cost is usually the most important parameter determining the success or failure of a packaging solution.  In fact, it is usually a balancing act of cost and performance that must be successfully equalized.  However, many designers do not have a full grasp of the cost drivers that effect possible solutions.  In addition, new technologies are emerging and old technologies are being applied in new ways.  Increased awareness of cost impacts will increase the effectiveness of any engineering tasked with developing or managing microwave, millimeter-wave or high speed packaging.

This session will review major packaging process technologies available for electronics and the issues that effect cost for those technologies.  These are HTCC, LTCC, thick film, thin film, laminates, metal housings with glass seals, HDI, LCP and emerging technologies.  Each of these will be explained with a goal of achieving understanding of cost drivers and how to apply the technology to real packaging problems.  Also, applications requiring low cost packaging examples will be presented.  Users will present how they have applied the available processes to yield cost effective packaging solutions.