WMK: TECHNOLOGY AND IMPLEMENTATION OF HIGH SPEED / GHZ DIGITAL INTERCONNECTIONS

Date & Time: Monday, June 13; 1:00 PM to 5:00 PM

Location: Long Beach Convention Center, Room 202AB

Topics & Speakers:  

• Overview of Gigabit Backplane Technologies: Optical vs Electrical, M. Mandich, Bell Laboratories

• Research in Multi-Gigabit Chip-to-Chip Connections, R. Mooney, Intel Corp.

• CDMA and FDMA based Interconnects for Future Inter-ULSI Communications, F. Chang, UCLA

• Novel Compliant Interconnects for 10 GHz and above, E. Bogatin , Interconnect Devices

• CMOS Equalizer for Multi Gigabit FR-4 Backplane Channels, J. Laskar, Georgia Institute of Technology

Organizers:

H. Boss,   Rohde & Schwarz

Y-K Chen, Bell Laboratories,

C. Pobanz, Inphi Corporation

Sponsor:

MTT-9: Digital Signal Processing  

Some years ago "high speed interconnections" were single 50 ¦¸ transmission lines between microwave transistors or amplifiers. This has changed as applications have progressed rapidly from the MHz- to the GHz-range (wireless systems, backplane communications, microprocessors, ¡­) and gigabit-rate digital signals are now routinely traversing low-cost PC boards and IC packages. Proper design and im-plementation of these systems requires expertise beyond digital design, into the realm of RF and microwave engineering.

This workshop will give a state of the art overview about technology and implementation of high speed interconnections. We will show the possibilities of high speed signaling with electrical and optical interconnections, present novel GHz interconnect-systems and the implementation of inter-connection-systems for such high speeds. The speakers are well recognized experts from research and industry and academia. There will be a panel discussing session following the presentations. All attendees are invited to participate in the discussion.