IMS2005 Home
Steering Committee Author Information Attendee Information Technical Program Social Program Exhibitor Information

 

WSD: ADVANCED SYSTEM SOLUTIONS AND INTEGRATION TECHNOLOGIES FOR HIGH-VOLUME WIRELESS-LAN APPLICATIONS

Date & Time: Sunday, June 12; 8:00 AM to 5:00 PM

Location: Long Beach Convention Center, Room 101AB

Topics & Speakers:

  • MIMO WLAN Transceiver Concepts and its Implication on the FEM development, A. Biran, Intel Corp

  • Design Considerations and Architectures for Dual-mode A/B/G Front-End for Cellular Applications , A. Shor, Atheros Communications

  • Ultra-Compact WLAN FEMs for the High-Volume Wireless Mobile Market, P. Heide, EPCOS AG       

  • High Density Microwave Circuitry on Si Substrate, C. Wang, Telephus Corp.  

  • Application Specific Integrated Organic Packages (ASIP), Jim Chamberlin, C. Conlin, JMD Technology

  • RF Front End Solution for W-LAN applying the state of the art LTCC technology, T. Hirai, Soshin Electric Corp.

  • LTCC Front End Module for WLAN Application (IEEE 802.11a/b/g), S. Kemmochi, H. Sano, Hitachi Metals

  • Architectures and Designs of Wireless LAN Front-End Modules for Portable and high power WLAN Radios, P. Huang, SiGe Semiconductor Inc

  • Small Size module for WLAN, K. Kato, Kyocera

  • Low Cost, Highly Integrated FEMs for Low Current and High Output Power WLAN Applications, C. Yuen, Epic Communications

Organizers:     

Patric Heide, EPCOS AG

Avi Biran, Intel Corporation

Clemens Ruppel, EPCOS AG  

Sponsors:

MTT-20: Wireless Communications

MTT-16: Microwave Systems

MTT-23: RF Integrated Circuits

2005 RFIC Symposium                        

The WLAN market demonstrated enormous growth rates in the last few years. Likewise the cellular phone market, the WLAN market has seen strong component cost reductions, with simultaneous increase in the complexity of WLAN radio transceivers - from single to multi-band / multi-mode solutions, coexistence with Bluetooth, novel cellular functions and, most recently - the realization of 802.11n and MIMO concepts. Apparently, the size of WLAN-radio transceiver RFIC and its adjacent FEM became a critical system-implementation factor. Wireless connectivity has become an embedded feature in mobile PCs, PDAs and smart phones, where, the number of functions per sq. mm is the limiting functionality factor. Very small WLAN RFICs with form factors compatible to CF and SD cards, memory sticks and USB-interfaces have been introduced in 2004. Highly-integrated FEM and single-chip radios have for the first time been applied to allow those innovative implementations. Most recently, the cellular industry has set the very challenging target of implementing a high-performance WLAN radio within 150 sq.mm (802.11g) and 250 sq.mm (802.11a + g) challenges. This will drive further the trend for higher integration levels, cost reduction, reliability and yield improvements.

 

IEEE MTT-S RFIC