WSE: IMPACT OF COMPONENT MODELLING ON MICROWAVE AND MILLIMETRE WAVE CIRCUIT PERFORMANCE  

Date & Time: Sunday, June 12; 8:00 AM to 12:00 PM

Location: Long Beach Convention Center, Room 102C

 Topics & Speakers:

• On-Chip and In-Package Passive Component Integration, G. Carchon, IMEC, Belgium

• Nonlinear Circuit Performance and FOM's, R. Trew, North Carolina State University, USA

• Modelling Devices at Millimeter Wave Frequencies, J. East, University of Michigan , USA

• Sensitivity of Linear Circuit Applications to Imperfect Component Models, A. Beyer, Duisburg-Essen University

• Relating Non-Linear Circuit Design Specifications to Properties of Component Models, S. Maas, Nonlintec 

Organizers:

D. Schreurs, K.U.Leuven

A. Beyer, Duisburg-Essen University

S. Maas, Nonlintec  

Sponsor:

MTT-1: Computer-Aided Design  

The objective of this Workshop is to shed a light on the interactions happening in the chain leading to successful circuit designs. One obvious aspect is the propagation of Figures of Merit (FOMs) of passive and active components into microwave circuit performance. Technology reproducibility and quality of component models are two other key factors. The first part of the Workshop focuses on the component level. The usual FOMs (Q, fT, fMAX, FMIN, ¡­,) supplemented by other requirements that are of high importance (low-power consumption, cost, area, level of integration, ¡­) are first reviewed. Trade-offs are illustrated by inter-comparing several fabrication technologies of passive and active components. As example, the varying quality of a spiral inductor as processed on GaAs, bulk Si, back-end Si, and MCM-D substrates, is mentioned. Next, the interrelationships between model requirements and circuit specifications are addressed. An example is the necessity of having temperature-dependent models when designing power amplifiers, while this is optional in oscillator design. Due to the more complex modulation schemes on the system level, model requirements have become more stringent and now require validations of e.g., EVM and ACPR predictabilities. The relative importance of these key technology and modelling indicators across the spectrum of microwave and millimetre wave circuits (LNA, oscillator, PA, mixer, ¡­) are covered. Finally, participants are given the opportunity to share their views.