Professor Tentzeris graduated from Ionidios Model School of Piraeus, receiving his degree in Electrical Engineering and Computer Science from the National Technical University in Athens, Greece, and then M.S. and Ph.D. degrees in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor. He is currently a Ken Byers Professor in the area of flexible electronics with the School of ECE, Georgia Tech and he has published more than 600 papers in refereed Journals and Conference Proceedings, 5 books and 25 book chapters. He has served as the Head of the Electromagnetics Technical Interest Group of the School of ECE, Georgia Tech. Also, he has served as the Georgia Electronic Design Center Associate Director for RFID/Sensors research from 2006-2010 and as the GT-Packaging Research Center (NSF-ERC) Associate Director for RF research and the leader of the RF/Wireless Packaging Alliance from 2003-2006. Dr. Tentzeris is also the Head of the A.T.H.E.N.A. Research Group. He is a Fellow of IEEE, a member of MTT-15 Committee, an Associate Member of European Microwave Association (EuMA), a Fellow of the Electromagnetics Academy, and a member of Commission D, URSI and of the the Technical Chamber of Greece. He is the Founder and Chair of the newly formed IEEE MTT-S TC-24 (RFID Technologies). He is one of the IEEE C-RFID Distinguished Lecturers and he has served as one IEEE MTT-Distinguished Microwave Lecturers (DML).
In this talk, inkjet-printed UHF and microwave circuits fabricated on paper substrates are investigated for the first time as an approach that aims for a system-level solution for fast and ultra-low-cost mass production. First, the RF characteristics of the paper substrate are presented by using the microstrip ring resonator in order to characterize the relative permittivity and loss tangent of the substrate at the UHF band for the first time reported. A UHF RFID tag module is then developed with the inkjet-printing technology, proving this approach could function as an enabling technology for much simpler and faster fabrication on/in paper. Simulation and well-agreed measurement results, which show very good agreement, verify a good performance of the tag module. In addition, the possibility of multilayer RF structures on a paper substrate is explored, and a multilayer patch-resonator bandpass filter demonstrates the feasibility of ultra-low-cost 3-D paper-on-paper RF/wireless structures. Various examples of inkjet-printed nanostructures (e.g. CNT’s) on paper as well as benchmarking with other flexible materials (e.g., LCP) will conclude the talk.