Xun Luo

Xun Luo

Status

  • Letters Editors, Microwave and Wireless Components Letters, Publications**
  • Microwave and Wireless Components Letters, Publications**
  • Track Editor, Letters Editors, Microwave and Wireless Components Letters, Publications**

Biography

Xun Luo received the B.E. and Ph.D. degrees in electronic engineering from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2005 and 2011, respectively.

From 2010 to 2013, he was with Huawei Technologies Co., Ltd., as the Project Manager to guide R&D Projects of multi-band microwave/mm-wave integrated systems for backhaul and wireless communication. Since 2015, he has been with UESTC as a Full Professor and has been appointed as the Executive Director with the Center for Integrated Circuits. Before joined UESTC, he was an Assistant Professor with the Department of Microelectronics, Delft University of Technology. He has authored or co-authored about 70 journal and conference papers. He holds/filed more than 50 patents. His research interests include the RF/microwave/mm-wave integrated circuits, multi-resonance THz modules, multi-bands backhaul/wireless system, reconfigurable passive circuits, smart antenna, and system in package.

Dr. Luo is a Technical Program Committee Member of the IEEE International Microwave Symposium (IMS), the IEEE International Wireless Symposium (IWS), and the IEEE MTT-Society TC-8 (Filters and Passive Components) and TC-20 (Wireless Communications). He was bestowed by China as the Recruitment Program of Global Experts in 2015 and the China Overseas Chinese Contribution Award in 2016. He also received the UESTC Distinguished Innovation and Teaching Award in 2018 and the UESTC Outstanding Undergraduate Teaching Promotion Award in 2016. His research group BEAM X-Lab received multiple best paper awards and best design competition awards, including the IEEE IWS Best Student Paper Award in 2015 (1st Place) and 2018 (2nd Place), the IEEE IMS Best Student Design Competition Award in 2017 (1st Place) and 2018 (2nd Place), and multiple best paper award finalists at the IEEE conferences. He is the TPC Co-Chair of IEEE IWS in 2018 and IEEE RFIT in 2019. He serves as Track Editor of IEEE Microwave Wireless and Components Letters, and is also an Associate Editor of IET Microwaves, Antennas & Propagation.