Substrate Integrated Circuits (SICs) – A Paradigm for MHz-to-THz (MTT) Electronic and Photonic Systems

Date of original webcast: 
Tuesday, October 11, 2016
Duration: 
59 minutes
Format: 
mp4
Summary 
Widespread applications and commercial success of GHz and THz electronic and photonic devices and systems, including RF, microwaves, and millimeter-waves are closely related to their manufacturing cost and antenna-circuit integration. Our proposed integration technology of planar and non-planar structures as well as related new progress indicate that the emerging substrate integrated circuits (SICs) are able to provide unprecedented advantages for developing low-cost GHz/THz components, antennas, circuits and systems as well as wireless photonic applications.This webinar will review state-of-the-art and underlying features of the proposed integration platforms for designing the next generation RF/millimeter-wave/THz ICs and systems. Challenging issues and future directions will be discussed for R&D opportunities. Potential problems and possible solutions will also be presented.It is believed that the technological platform of SICs will offer a cost-effective and performance-promising solution for mass commercial applications. With the development of innovative fabrication processes and material synthesis techniques, unique hybrid and monolithic high-density integration of planar and non-planar structures (or system-on-substrate approach) become realizable. It can also be demonstrated that this scheme of SICs may be able to effectively bridge the gap between electronics and photonics. In this presentation, global research activities and future RF/millimeter-wave developments will be discussed.
Speakers 
Dr. Ke Wu

Dr. Ke Wu holds the Canada Research Chair in RF and millimeter-wave engineering. He is also the NSERC-Huawei Endowed Industrial Research Chair in Future Wireless Technologies. He has been the Director of the Poly-Grames Research Center and the Founding Director (2008-2014) of the Center for Radiofrequency Electronics Research of Quebec. He held/holds visiting/honorary professorships at various universities around the world. He has authored/co-authored over 1100 referred papers, and a number of books and book chapters and is responsible for more than 40 patents. Dr. Wu was the general chair of the 2012 IEEE MTT-S International Microwave Symposium. He is the 2016 President of the IEEE Microwave Theory and Techniques Society (MTT-S). He also serves as the inaugural North-American representative in the General Assembly of the European Microwave Association. He was the recipient of many awards and prizes including the inaugural IEEE MTT-S Outstanding Young Engineer Award, the 2004 Fessenden Medal of the IEEE Canada, the 2009 Thomas W. Eadie Medal from the Royal Society of Canada, the Queen Elizabeth II Diamond Jubilee Medal, the 2013 Award of Merit of Federation of Chinese Canadian Professionals, the 2014 IEEE MTT-S Microwave Application Award, the 2014 Marie-Victorin Prize, the 2015 Prix d’Excellence en Recherche et Innovation of Polytechnique Montréal and the 2015 IEEE Montreal Section Gold Medal of Achievement. He was an IEEE MTT-S Distinguished Microwave Lecturer from Jan. 2009 to Dec. 2011. Dr. Ke Wu is a Fellow of the IEEE, a Fellow of the Canadian Academy of Engineering and a Fellow of the Royal Society of Canada.

Michael C. Hamilton, Ph.D.

Dr. Michael Hamilton is an Associate Professor, Electrical and Computer Engineering Dept., Auburn University and Assistant Director of the Alabama Microelectronics Science and Technology Center.

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