Technical Committee 16 deals with topics relating to microwave interconnects and packaging and includes questions of materials, modeling, standards, and manufacturing. The committee defines a package as a structure that supports and interconnects disparate technologies. This definition covers a broad variety of structures ranging from the common surface mount package, which supports a semiconductor die and interconnects it with a printed circuit board, to microwave-photonic packaging which supports both electrical and optical technologies and their interconnections. Other package-impacted technologies with which MTT-16 has become involved in recent years include; MEMS, active antennas, millimeter -wave devices, and System-in-Package concepts. The interest level in MTT-16 topics remains quite high because cost pressure and miniaturization has increased integration levels. This trend results in fewer packages per system; however, each package is highly sophisticated. MTT-16 works to disseminate and promote the rapid advances that are taking place in this area. One major function of the committee is the organization of special sessions, workshops, panel session, and other forums for technical interchange. Ideas are discussed at the committee’s yearly meeting in June, and committee members chosen as organizers. Almost all proposed technical forums occur at the next year’s MTT symposium. Proposals are fleshed out during the summer and reviewed in the fall. Occasionally the technical focus of an event will overlap the mission of another technical committee, and joint sponsorship is sought. Efforts are made to avoid duplicate forums.
* Multi-chip Modules
* System in Package
* Heterogeneous integration
* 3D printing/additive manufacturing
* Thermal management
Ask MTT – LinkedIn Group Got a microwave-related question? Join the “Ask MTT” LinkedIn Group! Post here and expect an answer from expert members of the IEEE Microwave Theory and Technology Society (MTT-S). These world-class experts are the closest we can get to the ancient Greek “Oracle” but you can trust their answers for sure. […]
IEEE Microwave Magazine – September 2023 The September issue of the IEEE Microwave Magazine is out! We have a fascinating issue with something for everyone. We go from old school broadband amplifiers and filters to computer intelligence helping us design wireless power transfer systems and even quantum radar. This is a very diverse issue. Of […]
IEEE Microwave Magazine – August 2023 The August issue of the IEEE Microwave Magazine is out! This issue features wireless communication at 100 Gb/s and beyond. Even our application note is about communication above 100 Gb/s. The Guest Editor’s Desk will give you all the details on the features. We also have a great set […]
IEEE Awards IEEE Rao R. Tummala Packaging Technology Award which is a prestigious IEEE Technical Field Award for meritorious contributions to the advancement of components, electronic packaging, or manufacturing technologies. Madhavan Swaminathan, Full Professor, Head of Electrical Engineering and William E. Leonhard Endowed Chair of the Pennsylvania State University, USA … for contributions to semiconductor […]
Call for Nomination IEEE MTT-S and AP-S Inter-Society Distinguished Lecturer Starting from 2023, the IEEE Microwave Theory and Technology Society (MTT-S) together with the IEEE Antennas and Propagation Society (AP-S) have launched an Inter-Society Distinguished Lecturer (ISDL) program. This aim of the ISDL program is to strengthen and increase the bilateral collaboration and […]
We are thrilled to invite you to the first-ever all-virtual World Microwave Congress 2024, sponsored by IEEE MTT-S, and supported by leading industry players. This congress aims to deliver top-quality speakers, interactive industry workshops, and master classes tailored for students, young professionals, and practitioners alike at a very low cost ($10 and more). Sessions include a wide […]
